Most smartphones and tablets need to be passively cooled. Heat from the device It can escape. Active cooling would be desirable so that this heat generated can better escape from the device. However, the current fans are too big to do this. They don't fit in ultra-slim devices. They are too big for some laptops like the M2 MacBook Air.
Manufacturer xMEMS A new ventilation technology has been developed that transfers a certain feature of so-called solid-state drives from the speakers to the smartphone's cooling fan. Your new fan, XMC-2400 CoolingIt features an ultra-thin design and eliminates any moving components because it is made from a single piece of silicon. As a solid-state fan, it can be connected directly to the chip.
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This drawing shows the structure of the fan on the chip.
© XMEMS
Thin devices are trendy.
With only 1mm thickness This fan can be used to cool very thin smartphones and tablets. This is a great advantage, especially considering the trend towards smaller devices that at the same time require more power for new technologies such as artificial intelligence.
It is conceivable that the company will use the new ventilation to make devices that are particularly thin and at the same time more powerful. For example, it would improve devices like the M2 MacBook Air, which currently causes problems when left in the sun. Tablets like the iPad Pro could become more powerful than before thanks to the new fan.
This illustration shows how the heat emitted from the chip can escape through the built-in ventilation.
© XMEMS
Ultrasound modification
In developing the new fan, the company was able to leverage its manufacturing expertise. Headphone technology Backtracking. Although at first glance, headphones and fans have nothing to do with each other, there is one thing they have in common: both systems move. air.
According to xMEMS director Mike Householder, the XMC-2400 uses so-called cooling chips. Ultrasound modificationfor pressure pulses To generate. This moves air. The fan weighs less than 150 milligrams, and can “move up to 39 cubic centimeters of air per second with 1,000 pascals of backpressure,” he told Engadget.
Less parts to break
Because it is one piece, the device has fewer parts that can break. This is how this system comes about. Without moving the rotors or slides. Outside. And because the fan is so thin, it can be used right where heat is generated – on components like APUs and GPUs. It's also dust and water resistant with an IP58 rating.
In addition to xMEMS, there are also other companies working on ultra-thin solid-state cooling, including Frozen With the Air Jet Mini and Mini Slim. However, these fans are noticeably thicker at just under 2.5mm. The Verge actually tested one on a MacBook Air, where it helped improve performance. xMEMS plans to sell its new fans to a handful of partner companies this year for $10 each.
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